Types of SMD Components: A Comprehensive Guide

Introduction

Surface Mount Device (SMD) components are integral elements in the world of electronics. These tiny devices have paved the way for miniaturized circuits, enabling sleeker designs and enhanced performance. SMD components play a crucial role in the functioning of electronic circuits, making it essential for anyone involved in electronics to understand them. Whether you're an electronics enthusiast, a professional engineer, or simply curious about the inner workings of your everyday devices, this guide will provide you with a comprehensive understanding of SMD components.

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Understanding SMD Components

Surface-mount devices (SMDs) are electronic components mounted directly to the surface of a printed circuit board (PCB). They have largely replaced through-hole technology (THT) components, which require holes to be drilled in the PCB for installation. SMD components are preferred due to their smaller size and higher component density, which allows for more compact and efficient circuit design.

SMD components play a critical role in the functioning of electronic devices. They are used in virtually all modern electronic equipment, including computers, mobile phones, and home appliances. Their primary function is to control the flow of electricity in a circuit, but they can also perform various other tasks depending on the specific component type.

The use of SMD components offers several advantages over traditional through-hole components. Firstly, they are smaller and lighter, which allows for the creation of smaller and more portable electronic devices. Secondly, they can be placed on both sides of a PCB, increasing the circuit density and allowing for more complex circuit designs. Finally, SMD components can be installed using automated equipment, which reduces manufacturing costs and increases production speed.

Basic Types of SMD Components

Surface Mount Device (SMD) components come in a variety of types, each with its unique function in an electronic circuit. The basic types of SMD components include resistors, capacitors, and inductors.

Resistors

Resistors are one of the most common types of SMD components. They are used to limit the flow of electric current in a circuit. The resistance of a resistor is measured in ohms (Ω), and SMD resistors typically have resistance values ranging from 1 ohm to several megaohms.

Resistors on the Printed Circuit Board Assembly (PCBA) of an electronic device

SMD resistors come in various types, each designed for a specific application. For instance, thin-film resistors are known for their high precision and stability, making them ideal for precision applications such as instrumentation. They are typically available in resistance values ranging from 1 ohm to 3 megaohms, with tolerance values as low as 0.01%. [1]

On the other hand, thick-film resistors are more common and less expensive than thin-film resistors. They are typically used in general-purpose applications where high precision is not required. Thick-film resistors are available in a wide range of resistance values, from 1 ohm to several gigaohms, with tolerance values typically ranging from 1% to 5%.

Another type of SMD resistor is the current sense resistor, which is used to measure electric current. These resistors have very low resistance values, typically less than 1 ohm, and are designed to produce a voltage drop, proportional to the current flowing through them. This voltage drop can then be measured and used to calculate the current.

In addition, specialty resistors such as wire-wound resistors, known for their high power handling capability, and metal foil resistors offer extremely high precision and stability. The choice of resistor type depends on the specific requirements of the application.

Capacitors

Capacitors are another fundamental type of SMD component. They store and release electrical energy in a circuit, acting like a temporary battery. Capacitors are used in various applications, including filtering noise, stabilizing voltage, and storing energy for later use.

Capacitors on the Printed Circuit Board of an electronic device

The capacitance of a capacitor, which measures its ability to store electrical charge, is measured in farads (F). However, most capacitors used in electronic circuits have capacitance values in the microfarad (µF), nanofarad (nF), or picofarad (pF) range.

SMD capacitors come in several types, each with its unique characteristics. Ceramic capacitors are the most common type of SMD capacitor. They are inexpensive, have a wide range of capacitance values, and are non-polarized, meaning they can be installed in either direction. However, their capacitance can vary with temperature and voltage, which can disadvantage precision applications.

Tantalum capacitors are another type of SMD capacitor. They offer higher capacitance values and better stability than ceramic capacitors, but they are polarized and more expensive. Tantalum capacitors are typically used in power supply circuits due to their high capacitance-to-volume ratio. [2]

Another type of SMD capacitor is the film capacitor. Film capacitors are known for their high precision, stability, and reliability. They are typically used in high-frequency applications such as RF circuits and high-quality audio equipment.

Finally, there are electrolytic capacitors, which offer very high capacitance values but have lower precision and stability than other capacitors. They are polarized and have a limited lifespan, especially when operated at high temperatures. Electrolytic capacitors are typically used in power supply circuits requiring high capacitance.

Each type of capacitor has its strengths and weaknesses, and the choice of capacitor type depends on the specific requirements of the application.

Recommended Reading: How to Discharge a Capacitor: Comprehensive Guide

Inductors

Inductors are another type of SMD component that play a crucial role in electronic circuits. They are used to store energy in a magnetic field when electric current flows through them. Inductors are primarily used in analog circuits and power supplies to filter out high-frequency noise and stabilize the current flow.

Toroidal inductors and a transformer during the PCB manufacturing of an electronic device

The inductance of an inductor, which measures its ability to store energy in a magnetic field, is measured in henries (H). However, most inductors used in electronic circuits have inductance values in the microhenry (µH) or nanohenry (nH) range.

SMD inductors come in several types, each with its unique characteristics. Wirewound inductors are the most common type of SMD inductor. They are made by winding a wire around a magnetic core, offering high inductance values and high current handling capability. However, their inductance can vary with frequency, disadvantaging high-frequency applications.

Another type of SMD inductor is the multilayer inductor. Multilayer inductors are made by stacking multiple layers of a magnetic material, and they offer high inductance values in a small package. However, they have lower current handling capability compared to wire-wound inductors.

Ferrite bead inductors are a particular type of inductor used to filter out high-frequency noise in electronic circuits. They are made by threading a wire through a bead made of ferrite material. [3] Ferrite bead inductors have high resistance at high frequencies, which allows them to filter out the high-frequency noise. 

Each type of inductor has its strengths and weaknesses, and the choice of inductor type depends on the specific requirements of the application. For instance, a wire-wound inductor might be chosen for a power supply circuit due to its high current handling capability. In contrast, a ferrite bead inductor might be chosen for a signal processing circuit due to its noise-filtering capability.

Advanced Types of SMD Components

Advanced types of SMD components or Small Outline Transistors (SOT) include diodes, transistors, and integrated circuits (ICs). These components are more complex than basic surface mount components and are used in a wide range of applications, from power management to signal processing.

Diodes

Diodes are semiconductor devices that allow current to flow in one direction while blocking it in the opposite direction. They are used in various applications, such as rectification, voltage regulation, and signal processing.

Semiconductor diode during the PCB assembly process of an electronic device

SMD diodes come in several types, each with its unique characteristics and applications. One common type is the rectifier diode, which converts alternating current (AC) to direct current (DC) in power supplies. Rectifier diodes have a high current handling capability and can withstand high reverse voltages.

Another type of SMD diode is the Schottky diode, known for its low forward voltage drop and fast switching speed. Schottky diodes are used in high-frequency applications, such as radio frequency (RF) circuits and switching power supplies. [4]

Zener diodes are another type of SMD diode, used for voltage regulation. They have a specific voltage limit beyond which they begin to conduct in the reverse direction. This property allows them to maintain a constant voltage across their terminals, making them useful for voltage regulation in electronic circuits.

Light-emitting diodes (LEDs) are a particular type of diode that emits light when a current flows through them. SMD LEDs are used in a wide range of applications, from indicator lights to display panels.

A triode is a vacuum tube consisting of three electrodes: a heated filament or cathode, a grid, and a plate (anode). SMD triodes are used in a wide variety of electronic devices, and they offer a number of advantages over traditional through-hole triodes.

Each type of diode has its strengths and weaknesses, and the choice of diode type depends on the specific requirements of the application. For instance, a rectifier diode might be chosen for a power supply circuit due to its high current handling capability, while a Schottky diode might be chosen for a high-frequency application due to its fast switching speed.

Transistors

Transistors are semiconductor devices that amplify or switch electronic signals and electrical power. They are one of the most important components in modern electronics industry and are used in various applications, from digital logic circuits to power amplifiers.

Transistor on an LCD TV printed circuit board

SMD transistors come in several types, each with its unique characteristics and applications. One common type is the bipolar junction transistor (BJT), which consists of two semiconductor junctions and can be NPN or PNP. BJTs are used in various applications, such as amplification, switching, and voltage regulation.

Another type of SMD transistor is the field-effect transistor (FET), which operates by controlling the flow of current through a semiconductor channel. FETs are further divided into two main categories: junction gate field-effect transistors (JFETs) and metal-oxide-semiconductor field-effect transistors (MOSFETs). [5] JFETs are typically used in low-noise, high-input impedance applications, while MOSFETs are used in high-speed switching and power management applications.

MOSFETs are particularly popular in modern electronics due to their high switching speed, low power consumption, and high input impedance. They come in two main types: enhancement-mode MOSFETs and depletion-mode MOSFETs. Enhancement-mode MOSFETs are normally off and require a gate voltage to turn on, while depletion-mode MOSFETs are normally on and require a gate voltage to turn off.

Each type of transistor has its strengths and weaknesses, and the choice of transistor type depends on the specific requirements of the application. For instance, a BJT might be chosen for a linear amplifier circuit due to its high current gain, while a MOSFET might be chosen for a switching power supply due to its high switching speed and low power consumption.

Recommended Reading: PMOS VS NMOS: Focus on Two Main Forms of MOSFET

Integrated Circuits (ICs)

Integrated Circuits (ICs) are complex electronic components that contain multiple transistors, diodes, resistors, capacitors, and other components on a single semiconductor chip. ICs are used in various applications, from microprocessors and memory chips to analog-to-digital converters and power management circuits.

Integrated Circuit (IC) on computer motherboard

SMD ICs come in various types, each designed for a specific application. One common type is the digital IC, which includes microprocessors, microcontrollers, and digital signal processors (DSPs). Digital ICs are used in applications requiring processing and manipulating digital data, such as computers, smartphones, and digital audio equipment.

Another type of SMD IC is the analog IC, which includes operational amplifiers (op-amps), comparators, and voltage regulators. Analog ICs are used in applications that involve the processing of analog signals, such as audio amplifiers, sensors, and power supplies. Mixed-signal ICs combine digital and analog circuits on a single chip. They are used in applications requiring digital and analog processing, such as data converters and radio frequency (RF) circuits.

Power management ICs are a specialized type of SMD IC, designed to manage and distribute power in electronic devices. They include voltage regulators, battery chargers, and power switches. Power management ICs are used in various applications, from mobile phones and laptops to electric vehicles and solar power systems.

Each type of IC has its strengths and weaknesses, and the choice of IC type depends on the specific requirements of the application. For instance, a digital IC might be chosen for a computer motherboard due to its high processing capability. In contrast, an analog IC might be chosen for an audio amplifier circuit due to its ability to process analog signals.

Recommended Reading: What is a Semiconductor? A Comprehensive Guide to Engineering Principles and Applications

SMD Component Sizes and Codes

SMD components come in various sizes and codes, which are essential to understand when selecting and using these components in electronic circuits. The size and code of an SMD component provide information about its physical dimensions and electrical characteristics, allowing engineers and technicians to choose the appropriate component for a specific application.

SMD components are typically identified by a standardized code system, which consists of alphanumeric characters. This code system varies depending on the type of component, such as resistors, capacitors, or inductors.

Resistor Sizes and Codes

SMD resistors are identified by a three or four-digit code, which indicates their resistance value, and tolerance. The first two or three digits represent the significant figures of the resistance value, while the last digit indicates the multiplier. For example, a resistor with the code "103" has a resistance value of 10 x 10^3 ohms, or 10 kilohms.

Resistors of different codes and sizes

SMD resistors also come in various standard sizes, denoted by a two-digit code, such as , , or . The first two digits represent the length of the resistor in hundredths of an inch, while the last two digits represent the width. For example, a resistor measures 0.06 inches in length and 0.03 inches in width.

Capacitor Sizes and Codes

SMD capacitors are identified by a three-digit code, which indicates their capacitance value and voltage rating. The first two digits represent the significant figures of the capacitance value, while the last digit indicates the multiplier. For example, a capacitor with the code "104" has a capacitance value of 10 x 10^4 picofarads, or 100 nanofarads. 

Capacitors of different colors and sizes

Like resistors, SMD capacitors come in various standard sizes, such as , , or . The size code follows the same convention as resistors, with the first two digits representing the length and the last two digits representing the width.

Inductor Sizes and Codes

SMD inductors are identified by a four-digit code, which indicates their inductance value and tolerance. The first three digits represent the significant figures of the inductance value, while the last digit indicates the multiplier. For example, an inductor with the code "" has an inductance value of 10 x 10^2 microhenries or 1 millihenry.

Toroidal inductors and transformers of different specifications

SMD inductors also come in various standard sizes, similar to resistors and capacitors. The size code follows the same convention, with the first two digits representing the length and the last two digits representing the width. 

Understanding surface mount component sizes and codes is crucial for selecting the appropriate components for a specific application and ensuring the proper functioning of electronic circuits.

SMD Component Selection and Application

Careful selection of SMD components

Selecting the appropriate SMD packages for a specific application is crucial to ensure the proper functioning and performance of an electronic circuit. Several factors need to be considered when choosing SMD components, which include: 

Electrical Characteristics

The electrical characteristics of an SMD component, such as resistance, capacitance, or inductance, must be suitable for the intended application. For example, a resistor with the correct resistance value is necessary to limit the current flow in a circuit. In contrast, a capacitor with the appropriate capacitance value is required for filtering or energy storage purposes. It is essential to consult datasheets and reference designs to determine the appropriate electrical characteristics for a specific application.

Physical Dimensions

The physical dimensions of an SMD component, such as its length, width, and height, must be compatible with the available space on the printed circuit board (PCB). Additionally, the component size should be suitable for the manufacturing process, as smaller components may require more precise placement and soldering techniques. Standard SMD component sizes, such as , , or , can be used as a starting point when selecting components for a specific application.

Compatibility with Other Components

SMD components must be compatible with other components in the circuit, both electrically and mechanically. For example, a capacitor with a high voltage rating may be required if it is connected to a high-voltage power supply, while a resistor with a high power rating may be necessary if it is used in a high-current application. Additionally, components with similar temperature coefficients should be used in temperature-sensitive applications to ensure consistent performance over a wide temperature range.

Examples of SMD Component Selection and Application

1. In a power supply circuit, a combination of SMD resistors, capacitors, inductors, diodes, and transistors may be required to regulate and filter the output voltage. The selection of these components will depend on factors such as the input voltage, output voltage, load current, and efficiency requirements.

2. In a radio frequency (RF) circuit, SMD capacitors and inductors may create filters that allow specific frequencies to pass while blocking others. The selection of these components will depend on the desired filter characteristics, such as the center frequency, bandwidth, and attenuation.

3. In a microcontroller-based circuit, SMD resistors and capacitors may be used for pull-up or pull-down resistors, decoupling capacitors, and timing circuits. The selection of these components will depend on factors such as the microcontroller's input and output requirements, power supply voltage, and timing constraints.

By carefully considering the electrical characteristics, physical dimensions, and compatibility with other components, the appropriate SMT components can be selected for a specific application, ensuring the optimal performance of the electronic circuit.

Soldering and Handling SMD Components

Soldering and handling SMD components require specific techniques and precautions to ensure the proper functioning and reliability of electronic circuits. SMD connectors are typically soldered to the PCB using a surface mount technology (SMT) process. The small size and delicate nature of SMD components make them more susceptible to damage during soldering and handling processes.

Soldering SMD component on Printed Circuit Board

Soldering Techniques

Soldering SMD components typically involves solder paste, a mixture of solder particles and flux. The solder paste is applied to the PCB pads using a stencil or a syringe, and the SMD components are then placed on the pads using tweezers or automated pick-and-place machines. The PCB is then heated in a reflow oven, which melts the solder paste and forms a reliable electrical and mechanical connection between the component and the PCB. Ball Grid Array (BGA) components are typically more difficult to solder and desolder than other SMD components, as they are located on the underside of the package. 

Several key factors are to consider when soldering SMD components:

1. Solder paste quality: The solder paste should have the appropriate viscosity and metal content to ensure proper wetting and adhesion to the PCB pads and component terminals.

2. Stencil design: The stencil should be designed to provide the correct amount of solder substrate on each pad, ensuring a reliable connection without causing solder bridges or insufficient solder joints.

3. Reflow profile: The reflow oven should be programmed with the appropriate temperature profile, which includes preheating, soaking, reflow, and cooling stages. This ensures that the solder paste melts and forms a reliable joint without damaging the components or the PCB. [6]

4. Component alignment: The SMD components should be accurately placed on the PCB pads to ensure proper alignment and electrical connection. 

QFP packages are commonly used for high pin count SMD integrated circuits, SOIC, or Plastic Leaded Chip Carrier (PLCC) components such as microprocessors, memory chips, and field-programmable gate arrays.  

Handling Precautions

Handling SMD components requires care and attention to avoid damage and ensure the reliability of the electronic circuit. Some key precautions to consider when handling SMD packages include:

1. Electrostatic discharge (ESD) protection: Many SMD components, such as ICs and transistors, are sensitive to electrostatic discharge, which can cause permanent damage. It is essential to use ESD-safe tools, such as tweezers and workstations, and to wear ESD wrist straps when handling these components. [7]

2. Mechanical stress: SMD components can be damaged by excessive mechanical stress, such as bending or twisting. Care should be taken when handling and placing these components to avoid applying excessive force.

3. Temperature and humidity control: SMD components can be sensitive to temperature and humidity, which can affect their electrical characteristics and reliability. It is essential to store and handle these components in a controlled environment to ensure their long-term performance.

By following the appropriate soldering techniques and handling precautions, SMD or SMT components can be successfully integrated into electronic circuits, ensuring optimal performance and reliability.

Recommended Reading: Solder Reflow: An In-Depth Guide to the Process and Techniques

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Conclusion

In conclusion, understanding the various types of SMD components, their functions, and applications is essential for anyone involved in electronics. From SOT components like resistors, capacitors, and inductors to advanced components such as diodes, transistors, and integrated circuits, each component plays a crucial role in the functioning of electronic circuits. Proper selection, soldering, and handling of these components are vital to ensure the optimal performance and reliability of electronic devices.

FAQs

Q: What are SMD components?

A: SMD (Surface Mount Device) components are electronic components that are mounted directly onto the surface of printed circuit boards (PCBs). They are used in a wide range of electronic devices and offer advantages such as smaller size, higher component density, and compatibility with automated manufacturing processes.

Q: What are the basic types of SMD components?

A: The basic types of SMD components include resistors, capacitors, and inductors. Each type has a specific function in electronic circuits, such as limiting current flow, storing electrical energy, or filtering signals.

Q: What are some advanced types of SMD components?

A: Advanced types of SMD components include diodes, transistors, and integrated circuits (ICs). These components are more complex than basic SMD components and are used in a wide range of applications, from power management to signal processing.

Q: How are SMD components sized and coded?

A: SMD components are sized and coded using standardized alphanumeric codes that indicate their physical dimensions and electrical characteristics. These codes vary depending on the type of component, such as resistors, capacitors, or inductors.

Q: What precautions should be taken when soldering and handling SMD components?

A: When soldering and handling SMD components, it is essential to use appropriate soldering techniques, such as using solder paste and a reflow oven, and to follow handling precautions, such as protecting against electrostatic discharge (ESD), avoiding excessive mechanical stress, and controlling temperature and humidity.

References

[1] Passive Components Blog. SMD Surface Mount Chip Resistor Selection Guide [Cited October 17] Available at: Link

[2] Electronics Notes. Understanding Tantalum Capacitors: technology, types, leaded, SMD [Cited October 17] Available at: Link

[3] Altium. How Do Ferrite Beads Work and How Do You Choose the Right One? [Cited October 17] Available at: Link

[4] Byjus. Schottky Diode [Cited October 17] Available at: Link

[5] ScienceDirect. Field Effect Transistor [Cited October 17] Available at: Link

[6] Research Gate. SMD Reflow Soldering: A Thermal Process Model [Cited October 17] Available at: Link

[7] ST Microelectronics. ESD Protection [Cited October 17] Available at: Link

1) BGA (Ball Grid Array)

BGA is one of the surface mount packages, and it has an array of spherical contacts. Spherical bumps are made on the back of the printed circuit board in a display mode to replace the pins. The LSI chip is assembled on the front side of the printed circuit board and then sealed by molding resin or potting. Pins can exceed 200, which is for a multi-pin LSI package.

The package body can also be made smaller than QFP(Quad Flat Package). For example, with a pin center distance of 1.5mm, a 360- pin BGA is only 31 square millimeters. On the other hand, with a pin center distance of 0.5mm, a 304-pin QFP is 40 square millimeters. Moreover, BGA does not have to worry about QFP pin deformation issues.

Motorola Corporation of the United States developed this package. It was first adopted in portable phones and other devices and may be popularized in personal computers in the United States in the future. Initially, the BGA pin (bump) center distance was 1.5mm, and the total number of pins was 225. There are also some LSI manufacturers that are developing 500-pin BGAs.

The problem with BGA is the visual inspection after reflow soldering. It is not yet clear whether an effective visual inspection method is available. Some believe that due to the large center distance of welding, the connection can be regarded as stable and can only be processed through functional inspection.

American Motorola Company calls the package sealed with molded resin as OMPAC, and the package sealed with potting method is called GPAC (see OMPAC and GPAC).

2) BQFP (Bumpered Quad Flat Package)

It is one of the QFP packages with protrusions (buffer pads) that are provided at the four corners of the package body to prevent bending and deformation of the pins during transportation. American semiconductor manufacturers mainly use this package in ASICs such as microprocessors and circuits. The pin center distance is about 0.635mm, and the pin number ranges from 84 to 196. (see QFP).

3) Butt Welding PGA(Butt Joint Pin Grid Array)

It is another name for Surface mount BGA (see surface mount BGA).

4) C-(ceramic)

It indicates the mark of the ceramic package. For example, CDIP stands for ceramic DIP. It is a mark that is often used in practice.

5) Cerdip

Ceramic dual in-line package, sealed with glass, is used for ECL RAM, DSP (digital signal processor), and other circuits. With glass windows, Cerdip is used for ultraviolet erasable EPROM. The pin center distance is 2.54mm, and the number of pins is from 8 to 42. In Japan, this package is expressed as DIP-G (G means glass seal).

6) Cerquad

It is one of the surface mount packages. The ceramic sealed QFP is used for packaging DSP logic under the seal, such as LSI circuits. With windows, Cerquad is used to encapsulate EPROM circuits. The heat dissipation is better than that of plastic QFP, and it can tolerate under natural air-cooling conditions of 1.5 to 2W of power. However, packaging costs three to five times higher than plastic QFP. The center distance between pins has a variety of specifications, such as 1.27mm, 0.8mm, 0.65mm, 0.5mm, 0.4mm, and so on. The number of pins ranges from 32 to 368.

7) CLCC (Ceramic Leaded Chip Carrier)

It is one of the surface mount packages that is a ceramic chip carrier with pins. The pins are drawn from the four sides of the package and are in a T-shape. With windows, it is used to package ultraviolet erasable EPROM and EEPROM microcomputer circuits. This package is also called QFJ, QFJ-G (see QFJ).

8) COB (Chip on Board)

Chip packaging is one of the bare chip mounting technologies. The semiconductor chip is handed over and mounted on the printed circuit board. The electrical connection between the chip and the substrate is made by wire stitching. The electrical connection between the chip and the substrate is covered with resin to ensure reliability. Although COB is the simplest bare chip mounting technology, its packaging density is far inferior to TAB and flip-chip bonding technology.

9) DFP (Dual Flat Package)

Dual Flat Package is another name for SOP (see SOP). This term was common, but it is not used now.

10) DIC (Dual in-line Ceramic Package) 

It is another name for ceramic DIP (including glass seal) (see DIP).

11) DIL (Dual in-line)

It is another name for DIP (see DIP). European semiconductor manufacturers often use this name.

12) DIP (dual in-line package) 

Dual in-line Package is one of the plug-in packages. The pins are drawn from both sides of the package, and the package materials are plastic and ceramic. 

DIP is the most popular plug-in package, and its application range includes standard logic ICs, memory LSIs, and microcomputer circuits. The pin center distance is 2.54mm, and the number of pins is from 6 to 64. The package width is usually 15.2mm. Some packages with a width of 7.52mm and 10.16mm are called skinny DIP and slim DIP (narrow DIP), respectively. But in most cases, no distinction is made, and they are simply collectively referred to as DIP. In addition, ceramic DIP sealed with low-melting glass is also called Cerdip (see Cerdip).

13) DSO (Dual Small Out-line) 

Dual Small Out-line package is another name for SOP (see SOP). Some semiconductor manufacturers use this name.

14) DICP (Dual Tape Carrier Package) 

Dual Tape Carrier Package is one of TCP (carrying package). The pins are made on the insulating tape and lead out from both sides of the package. Due to the use of TAB (Automatic On-Load Soldering) technology, the package outline is very thin. It is often used in LCD driver LSI, but most of them are customized products. In addition, the 0.5mm thick memory LSI book package is in the development stage. In Japan, in accordance with the EIAJ (Electronic Industries Association of Japan) standards, DICP is named DTP.

15) DTP (Dual Tape Carrier Package) 

It is the same as above DICP. The Electronic Industries Association of Japan names it DTP.

16) FP (Flat Package)

Flat Package is one of the surface mount packages. It is another name for QFP or SOP (see QFP and SOP). Some semiconductor manufacturers use this name.

17) Chip

Flip-chip welding is one of the bare chip packaging technologies to make metal bumps in the electrode area of &#;&#;the LSI chip and then connect the metal bumps with the electrode area on the printed circuit board. 

The footprint of the package is basically the same as the chip size. It is the smallest and thinnest of all packaging technologies. However, if the thermal expansion coefficient of the substrate is different from that of the LSI chip, a reaction will occur at the joint, which will affect the reliability of the connection. Therefore, it is necessary to use resin to reinforce the LSI chip and use a substrate material with substantially the same thermal expansion coefficient.

18) FQFP (Fine Pitch Quad Flat Package)

FQFP usually refers to the QFP with a lead center distance less than 0.65mm (see QFP). Some conductor manufacturers use this name.

19) CPAC (Globe Top Pad Array Carrier) 

American Motorola Company&#;s nickname for BGA (see BGA).

20) CQFP (Quad Flat Package with Guard Ring) 

It is a four-side pin flat package with a guard ring. It is one of the plastic QFPs in which the pins are masked with a resin protection ring to prevent bending and deformation. Before assembling the LSI on the printed circuit board, cut the lead from the guard ring and make it into a seagull wing shape (L shape). This kind of package has been mass-produced by Motorola Company in the United States. The pin center distance is 0.5mm, and the number of pins is about 208 at most.

21) H- (With Heat Sink)

It means a radiator. For example, HSOP means SOP with a heat sink.

22) Pin Grid Array (Surface Mount Type)

Usually, PGA is a plug-in package with a pin length of about 3.4mm. The surface mount PGA has display-like pins on the bottom surface of the package, and its length ranges from 1.5mm to 2.0mm. Mounting uses the method of butt welding with the printed circuit board, so it is also called butt welding PGA. Because the pin center distance is only 1.27mm, which is half smaller than the plug-in type PGA, the package body cannot be made so large. The number of pins is more than that of the plug-in type (250&#;528), which is a package for large-scale logic LSIs. The encapsulated substrates include multilayer ceramic substrates and glass epoxy resin printing bases. The packaging of multilayer ceramic substrates has been put into practical use.

23) JLCC (J-leaded chip carrier) J-leaded Chip Carrier

It is another name for CLCC with window and ceramic QFJ with window (see CLCC and QFJ). Some semiconductor manufacturers adopted the name.

24) LCC (Leadless Chip Carrier)

Leadless Chip Carrier refers to a surface-mount package in which the four sides of the ceramic substrate are only in contact with electrodes without leads. It is an IC package for high-speed and high-frequency, also called ceramic QFN or QFN-C (see QFN).

25) LGA (Land Grid Array)

Contact Display Package is a package with array state electrode contacts that are made on the bottom surface. Just plug in the socket when assembling. There are now practical ceramic LGAs with 227 contacts (1.27mm center distance) and 447 contacts (2.54mm center distance), which are used in high-speed logic LSI circuits.

Compared with QFP, LGA can accommodate more input and output pins in a smaller package. In addition, since the impedance of the lead is small, it is very suitable for high-speed LSI. However, due to the complicated production and high cost of sockets, they are basically not used much now. It is expected that its demand will increase in the future.

26) LOC (Lead on Chip)

Chip Lead Package is one of the LSI packaging technologies. It has a structure in which the front end of the lead frame is above the chip, bump solder joints are made near the center of the chip, and wire stitching is used for electrical connection. Compared with the original structure in which the lead frame is arranged near the side of the chip, the chip is contained in the same size package and has a width of about 1 mm.

27) LQFP (Low Profile Quad Flat Package)

Thin QFP refers to the QFP with a package body thickness of 1.4mm. It is the name used by the Japanese Electronic Machinery Industry according to the new form factor formulated QFP.

28) One of L-QUAD

Aluminum nitride is used for packaging substrates that have a thermal conductivity 7-8 times higher than aluminum oxide and have better heat dissipation. The frame of the package is aluminum oxide, and the chip is sealed by potting, thereby suppressing the cost. It is a package developed for logic LSI, which can tolerate W3 power under natural air-cooling conditions. 208-pin (0.5mm center distance) and 160-pin (0.65mm center distance) LSI logic packages have been developed, and mass production began in October .

29) MCM (multi module)

It is a package in which multiple semiconductor bare chips are assembled on a wiring substrate. According to the substrate material, it can be divided into three categories: MCM-L, MCM-C, and MCM-D.

MCM-L is a component using a common glass epoxy multilayer printed circuit board. The wiring density is not very high, and the cost is low. MCM-C uses thick film technology to form multilayer wiring and uses ceramic (alumina or glass-ceramic) as a substrate component, which is similar to a thick film hybrid IC using a multilayer ceramic substrate. There is no obvious difference between the two. The wiring density is higher than MCM-L. MCM-D uses thin-film technology to form multilayer wiring, with ceramic (aluminum oxide or aluminum nitride) of Si or Al as the substrate component. The wiring scheme is the highest among the three components, but the cost is also high.

30) MFP ( Mini Flat Package)

It is another name for plastic SOP or SSOP (see SOP and SSOP). It is the name adopted by some semiconductor manufacturers.

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