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Your Position: Home - Coating Services - High-Quality Sputtering Targets

High-Quality Sputtering Targets

Author: Helen

May. 20, 2024

High-Quality Sputtering Targets

Welcome to PhotonExport, your reliable partner for internationally certified sputtering targets. We take pride in offering the greatest variety of sputtering targets for thin film deposition.

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Our wide selection of materials, shapes, and purities allows you to find the perfect sputtering target for your specific thin film needs.

Acetron contains other products and information you need, so please check it out.

Sputtering Targets and Coil Sets

REDUCE DOWNTIME, INCREASE TARGET LIFE
Consistent target composition keeps your manufacturing running. By owning and operating metal refining and purification processes, we ensure that our metals have the lowest particulate counts in the industry, with the most consistent microstructure control down to the sub micron level.

We can meet your demand. Our metallurgical expertise enables us to produce targets that are ergonomically lightweight made with the highest quality metals. They are manufactured for the majority of original equipment manufacturer designs (OEM) found in physical vapor deposition (PVD) applications. We’ve increased targets production capacity, as well as our internal capacity to produce the copper, cobalt, titanium, and tungsten raw materials used to make the targets.

When you work with the world’s largest manufacturer of sputtering targets for the semiconductor industry, you can maintain your competitive edge.

Our dedicated research teams in Spokane have the application knowledge and experience to help you design your next generation products.

And as the need for targets in Photovoltaic industry grows, Honeywell Electronic Materials has the technical capabilities to match your needs as well.

Technology customized designs with:

Want more information on sputtering target materials? Feel free to contact us.

  • Major metals– AI/Ti, Cu/Ta, CoWTiW, TiAL
  • Semiconductor front end, Under-Bump Metalization (UBM)
  • Through silicon-via (TSV)
  • Patented ECAE technology ultrafine grain size

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